MLCP or Microchannel Liquid Cooling Plate represents a breakthrough in thermal management technology. It uses precisely engineered microchannels with widths ranging from 50 to 150 micrometers to create highly efficient heat transfer pathways. The manufacturing process requires extreme precision in channel formation and reliable sealing to prevent coolant leakage.
Substrate preparation is the foundation of MLCP manufacturing. We start with high-purity copper TU2 with purity greater than 99.95 percent. The process involves four critical steps: precision cutting, ultrasonic degreasing to remove oils and contaminants, acid etching to activate the surface, and vacuum annealing at 350 to 400 degrees Celsius to eliminate internal stress and ensure dimensional stability.
The photochemical etching process is the heart of microchannel formation. First, photoresist is spin-coated uniformly onto the copper substrate. A precision mask with channel patterns is aligned and UV light at 365 nanometers exposes selected areas. After development, chemical etching selectively removes copper to form microchannels with widths of 50 to 150 micrometers and dimensional tolerances within plus or minus 5 micrometers.
Vacuum diffusion bonding is critical for creating leak-proof seals. The microchannel substrate and cover plate are precisely aligned and placed in a vacuum chamber with pressure below 1 times 10 to the minus 4 pascals. Under temperatures of 850 to 950 degrees Celsius and pressure of 15 to 25 megapascals, copper atoms diffuse across the interface creating metallurgical bonds with strength exceeding 200 megapascals and leak rates below 1 times 10 to the minus 6 millibar liters per second.